De-capsulation
EquipmentChemical, Mechanical & Laser
A sample pretreatment process used to completely or partially remove a part of the synthetic encapsulant protecting a semiconductor die.
Introduction
Electronic components are surrounded by a synthetic sealant called Epoxy Molding Compound to protect the chip inside. The process of removing the synthetic sealant to observe the chip, gold wire or lead frame inside is called de-capsulation. De-capsulation is largely divided into hole de-capsulation, which selectively removes parts of EMC, and full de-capsulation, which removes all of EMC. Hole de-capsulation has the advantage of being able to perform additional electrical measurements because the process removes the EMC without damaging the internal wires and bonding pads. In addition to EMC, de-capsulation can be applied to glass or metal devices.
Application
EMC Material Hole & Full De-capsulation, LED mold or Gel Remove, IGBT Module De-capsulation, Sample Preparation for OM, FE-SEM/EDS, FIB, EMMI, and Wire Bond Pull Test
The Equipment
Selective area de-cap.
Laser de-caper (Can remove the Cu wire package without damage)
Can remove the Cu wire package without damage
Technical Use Case
De-capsulation
Failure Analysis : De-capsulation
Contact Point
Person in charge- • TEL.
- 010-6400-8094
- • E-mail.
- ec.fa@qrtkr.com