Application
ALD (Atomic Layer Deposition) coating is a thin-film deposition process that forms films at the atomic layer level. It enables the formation of highly uniform and dense protective layers even on complex 3D structures and high-aspect-ratio features. By applying ALD coating prior to TEM sample preparation, physical damage and interfacial deformation that may occur during FIB processing and thinning can be effectively minimized, ensuring more reliable TEM analysis results.
Introduction
Protective Coating Prior to FIB Processing
Uniform Thin-Film Coating Inside High-Aspect-Ratio Structures
The Equipment
-
Items
Specification
Model
Savannah S200/Veeco
Film Uniformity
Uniformity <2%
Process Temperature Range
RT~300℃
Deposition Rate
0.1nm/cycle (Al2O3)
0.075nm/cycle (HfO2)Deposition Materials
Al2O3, HfO2
Substract size
up to 200mm
Technical Use Case
