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This is an analytic technique used to observe cross-sections of electronic components, PCBs, and SMT levels. By checking the cross-section of the desired area, the structure can be analysed and the cause of defects can be detected. It is used to accurately check the defect area detected by Scanning Acoustic Tomography (SAT), and is often used to check defects, such as solder joint cracks or solder resist cracks, that are difficult to detect. In the process of grinding or polishing, the sliding phenomenon is removed through the Ion Mill system, so that a precise analysis of the defect can be performed.

Package, Chip Structure Analysis, Reverse Engineering, PCB Structure and Failure Analysis, Solder Joint Analysis