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Space & Aerospace Reliability Test Services

QRT provides specialized reliability testing services for the aerospace, space, and defense industries by precisely simulating extreme environmental conditions on the ground.Space systems are exposed to severe and combined environmental stresses, including:Intense vibration and shock during launchStructural loads during orbital insertionRepeated thermal expansion and contraction during operationEven a single structural defect or fastening failure can lead to total system failure. Therefore, ensuring mechanical integrity is a fundamental requirement in space system design.PIND TEST : Particle Impact Noise DetectionPrecision Non-Destructive Testing for Internal Loose ParticlesThe PIND test detects loose particles inside hermetically sealed semiconductor and electronic component cavities using vibration-based acoustic analysis. This method effectively identifies internal contaminants that are difficult to detect through visual inspection or X-ray analysis, preventing latent failures in aerospace and defense applications.Applicable DevicesThis test is applicable only to high-reliability components with internal cavities and hermetic sealing structures. (Eg. Hermetic transistors, Hermetic diodes, Switches)Non-hermetic devices (e.g., plastic mold types) are excluded. Test FeaturesPrecise acceleration control (0–20 g)Simultaneous audio and visual monitoringReal-time detection of micro particlesStandardsMIL-STD-883 Method 2020 / MIL-STD-750 Method 2052 / JEP114A / ESCC / NASA-STD-8739.10                                                                                     Seal Test : Hermeticity VerificationHermetic Integrity as the Foundation of Long-Term ReliabilityThe Seal Test evaluates the hermeticity of semiconductor packages and electronic components to prevent the ingress of moisture, gases, and contaminants that may cause corrosion or functional degradation. In aerospace applications, even microscopic leakage can result in catastrophic failure, making precise hermeticity verification essential.Applicable Devices·       Hermetically packaged semiconductor and electronic components·       Board-mounted hermetic devicesQRT operates the NorCom 2020 system for optical leak testing, offering the following advantages:         -. Non-destructive and contamination-free: Dry testing method without liquid media  -. Laser-based non-contact inspection: Prevents sample damage  -. High-efficiency integrated inspection process                                          Vibration Testing in CleanroomQRT operates vibration testing systems within an ISO 14644 1 Class 8 cleanroom environment. This setup allows accurate simulation of launch and operational vibration conditions while minimizing particle contamination during testing.Cleanroom Objectives-. Minimize particle contamination before during and after testing-. Maintain sample cleanliness and ensure test reliabilityTest Environment -. ISO 14644 1 Class 8 Cleanroom-. IMV Vibration System Sine Random Shock                        Thermal Vacuum TestThe Thermal Vacuum Test reproduces high vacuum and extreme temperature conditions similar to space and low Earth orbit environments. In a fully evacuated environment where convection is eliminated, the test identifies localized overheating, thermal imbalance, and functional instability to ensure sufficient thermal design margin and long term reliability.Test Objectives-. Verify thermal behavior and temperature distribution under vacuum-. Confirm functional stability under extreme temperatures-. Validate thermal design margin and durabilityApplicable Systems-. Satellite payload modules and components-. High altitude UAV modules and componentsStandards -. MIL STD 883 Method 1014-. MIL STD 750 Method 1071-. JESD22 A109-. ESCC                                           For inquiries and test requests, please visit the Contact Us section on our website.

26.02.23

QRT Partners with ZEN-EI to Strengthen Presence in the Japanese Market

<QRT Partners with ZEN-EI to Strengthen Presence in the Japanese Market>              QRT, a leading provider of  semiconductor reliability testing equipment and services, has partnered with ZEN-EI, a communications network specialist, to accelerate its expansion in the Japanese market.The two companies have signed a strategic partnership agreement focused on expanding sales of semiconductor reliability testing equipment and services in Japan, combining their technological expertise and services to leverage their combined strengths. Through this partnership, QRT and Zen-A plan to actively pursue new customer acquisition, project collaboration, and marketing activities, while also enhancing engagement with existing clients to further establish their presence in the Japanese market.With this agreement, QRT aims to enhance its competitiveness in semiconductor reliability testing and solidify its foundation for long-term growth.We appreciate your continued support and interest in QRT’s journey. Thank you.

25.03.21

Introduction of AEC-Q007: QRT Support for Automotive Component BLR Testing

Introduction of AEC-Q007: QRT Support for Automotive Component BLR TestingAEC-Q007 is one of the reliability standards for automotive electronic components, focusing on Board Level Reliability (BLR) testing. While AEC-Q104 also references BLR in Test Group H, it only provides limited guidance. In contrast, AEC-Q007 offers detailed explanations of PCB and Daisy Chain design methods, moving beyond standalone component tests to verification methods integrated with PCBs.ㅣ Automotive Electronics Council (AEC) Standards Series ㅣ▶ Step-by-Step Guidelines for Daisy Chain DesignAEC-Q007 offers comprehensive guidelines for Daisy Chain designs across various package types. It classifies Daisy Chain designs into four levels, managing complexity as follows:Level 3: Simplest design where the top layer of the component substrate connects solder balls to the PCB.Level 2: Extends wiring to internal layers of the substrate for additional assessment of potential damage or layer separation.Level 1: Connects wiring to internal chips to examine solder joints more deeply, particularly under thermal and mechanical stress.Level 0: Most complex design extending Level 1 connections within internal chips.These guidelines enable optimal Daisy Chain designs tailored to specific needs.ㅣAEC-Q007 – Classification of Daisy Chain Levelsㅣ▶ PCB Design Guidelines for BLR DurabilityAEC-Q007 emphasizes the importance of PCB design in BLR durability. Since the number of layers and thickness of the PCB affect test results, it is recommended to consider compatibility with components during PCB design. AEC does not mandate fixed specifications for PCB layers or thickness, taking into account the diverse environments in which components are used. Instead, it provides reference guidelines for PCB design, with the recommended option being an 8-layer PCB with a thickness of 1.6mmㅣBoard Design Presented in the AEC-Q007 Standard ㅣ▶ Component Characteristics and Durability Assessment: Temperature Cycling (TC) AEC-Q007 introduces Temperature Cycling (TC) as the primary verification method after component and PCB design are completed. While conventional BLR tests focus on determining a simple pass or fail result over 500–1000 cycles, AEC-Q007 aims to understand component characteristics. It emphasizes collecting failure data under thermal cycling conditions with components mounted on boards, providing valuable reference information for future users and designers.ㅣComparison of BLRT TC Conditions: AEC-Q104 vs. AEC-Q007 ㅣAt QRT, our expert engineers with years of experience in the BLRT field provide meticulous support throughout the entire testing process.For accurate and reliable test results, consider utilizing our services. For inquiries and submissions, please visit the 'Contact Us' section on our website.

24.11.25