BLR Vibration Equipment
EquipmentBLR Vibration Equipment
Vibration Test
An equipment that can simulate the vibration that the product is exposed to during process, transportation, and use.
Introduction
Electronic oscillators generate the vibration of the required amplitude, frequency, and acceleration. Sinewave oscillations are primarily used to explore resonant frequencies, and random oscillations are used for evaluations that simulate actual oscillations.
Application
It is used to evaluate the tolerance of solder joints, in portable electronic devices such as smartphones and vehicle electronic components, when processed, transported or used.
The Equipment
- Equipment
-
Bending Depth : Max 55 mm
Bending Shape : Sine & Triangluar
Bending Speed : Max 100 Hz
Technical Use Case
- Related Testing Spec
-
JESD22-B103
Reliability Testing Service Category based on Applications
Appendix
※ Failure Analysis DATA : Cross-Section, Dye & Pry
Component and PCB connected Board Level is used to evaluate the lifetime and tolerance of Solder Joints.
Major Evaluation Criteria
-
01.
BLR Drop Test [ JESD22-B111 ]
Evaluating the effects of a drop impact. -
02.
BLR Temperature Cycling Test [ JESD22-A104 ]
Evaluating the effects of thermal expansion differences caused by temperature changes. -
03.
BLR Temperature Humidity Storage Test [ JESD22-A101 ]
Evaluating stress in high temperature and high humidity environments. -
04.
BLR Cyclic Bending Test [ JESD22-B113 ]
Evaluating the effects of repeated bending. -
05.
BLR Vibration Test [ JESD22-B103 ]
Evaluating the effects of the vibration exposed during product transportation.
※ In addition to the key evaluation criteria, you can simulate defects that may occur in the process or field to evaluate the reliability of the solder joint.