BLR Bending Equipment
EquipmentCyclic Bending Test
An equipment that can repeatedly bend samples or PCBs.
Introduction
The PCB is bent repeatedly by the force applied in the process and in the use environment. The product mounted on the PCB can simulate the stress of the solder joint that occurs whenever the PCB is deformed.
Application
It is used to evaluate the stress tolerance of solder joints in portable electronic devices such as smartphones and vehicle electronic components.
The Equipment
- Equipment
-
Bending Depth : Max 55 mm
Bending Shape : Sine & Triangluar
Bending Speed : Max 100 Hz
Technical Use Case
- Related Testing Spec
-
JESD22-A101
Reliability Testing Service Category based on Applications
Appendix
※ Failure Analysis DATA : Cross-Section, Dye & Pry
Component and PCB connected Board Level is used to evaluate the lifetime and tolerance of Solder Joints.
Major Evaluation Criteria
-
01.
BLR Drop Test [ JESD22-B111 ]
Evaluating the effects of a drop impact. -
02.
BLR Temperature Cycling Test [ JESD22-A104 ]
Evaluating the effects of thermal expansion differences caused by temperature changes. -
03.
BLR Temperature Humidity Storage Test [ JESD22-A101 ]
Evaluating stress in high temperature and high humidity environments. -
04.
BLR Cyclic Bending Test [ JESD22-B113 ]
Evaluating the effects of repeated bending. -
05.
BLR Vibration Test [ JESD22-B103 ]
Evaluating the effects of the vibration exposed during product transportation.
※ In addition to the key evaluation criteria, you can simulate defects that may occur in the process or field to evaluate the reliability of the solder joint.