Moisture Sensitivity Level Classification
EquipmentMoisture Sensitivity Test
TAMURA / TNP40-578EN
Moisture Sensitivity Level Classification
Introduction
Provide handling cautions for the semiconductor assembly process Pre-treatment process for testing tolerance against temperature and moisture Evaluation of Delamination/Crack for High Temperature Soldering Process
Application
The equipment evaluates whether the product can withstand the high temperature environment of the assembly process (SMT). In addition, the product assembly process (SMT) has a significant impact on tests using temperature or moisture conditions (e.g., TC, uAST, HAST, THB, PCT). Before the reliability test, the stress generated by the SMT process is applied in advance to accurately evaluate defective mechanisms such as corrosion and delamination.
The Equipment
Moisture Sensitivity Level Classification
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- Manufacturer / Model
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TAMURA / TNP40-578EN
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- USE
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Provide handling cautions for the semiconductor assembly process
Pre-treatment process for testing tolerance against temperature and moisture
Evaluation of Delamination/Crack for High Temperature Soldering Process
Test Method
Different package shapes show different characteristics in water ingression. Thick through-hole packages tend to absorb more moisture per unit volume than thin SMD packages. A problem occurs when moisture penetrates and stays inside the package, and sudden exposure to high temperature(e.g. mounting process) stresses the package. Package cracks caused by moisture are called popcorn cracking. In general, surface-mounted products (SMDs) have a higher probability of popcorn cracking due to the such factors.
DATA EXAMPLE
Technical Use Case
Related Standards
- JESD47
- J-STD020