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HBM is used equally between IC level and system level, but module level (half-finished products) and set level ESD tests are classified into Gun ESD or System level ESD to reduce confusion. The related specification is IEC 61000-4-2 (Korea Standard KC61000-4-2). Semiconductors are evaluated on all pins using automated equipment, mainly by applying documents issued by MIL, JEDEC, and AEC.
In terms of general(consumer/commercial) products(Related specification: IEC 61000-4-2) and vehicle electronic parts (Related spec: ISO 10605), the GUN-ESD device is used to assess tolerance levels by applying stress set by the manufacturer's standards.

Module Level, System Set Level, Semiconductor(Memory, System IC), Discrete IC, Passive Component