Test Analysis & Equipment Utilization

Failure Analysis Service

Sample Preparation

Decapsulation( Epoxy molding compound)

Electronic components are molded by synthetic sealants called epoxy molding compound to protect the inside chips. Decapsulation is a process of removing synthetic sealants to observe internal chips, gold wire, or lead frame.
Decapsulation is broadly divided into two phases: Hole decapsulation to remove some of EMC selectively; full decapsulation to remove all of EMC. As the hole decapsulation process removes EMC without damaging internal wires and bonding pads, it has the strength to allow additional electric measurements. We provide decapsulation services for glass or metal devices as well as EMC.
Decapsulation ( Epoxy molding compound 제거 전처리)

Decapsulation Applications

  • Preconditioning for EMMI measurement
  • Preconditioning for repairing FIB circuits
  • Preconditioning for failure analysis of internal chips

Delayering(Stripping off the upper layers of chip)

Semiconductors consist of several metal layers and oxide films. Delayering is performed to strip off each of layers for analyzing the internal structure of semiconductors. The internal layers can be stripped off by chemicals-based wet etching, gas-based dry etching, and physio-chemical polishing techniques.
Metal 4 Layer / Metal 3 Layer / Metal 2 Layer / Metal 1 Layer / Poly Layer / Active Layer

Delayering Application

  • Aluminum layer etch
  • Copper layer etch
  • Silicon oxidation layer etch
  • Polysilicon layer etch
  • Each layer etching and analysis for compound semiconductors
  • Semiconductor failure analysis
  • Reverse engineering

Cross Section Analysis

Cross section analysis is used to observe the cross section of electronic components, PCB, and SMT level. The cross section of target areas is observed to analyze construction and detect the cause of failure. This technique is used to identify the spot of failure related to delamination detected by scanning acoustic tomography and frequently to identify difficult- -to-find failures, such as solder joint crack and solder resist crack.
Cross Section Analysis

Cross Section Applications

  • Package, Chip Construction Analysis
  • Reverse Engineering
  • PCB Analysis
  • Solder Joint Analysis

FIB(Focused Ion Beam)

A FIB system works very similarly to SEM, except that it uses a finely focused beam of gallium ions instead of the latter's use of electrons.
A FIB system can etch the minute area of a sample into a desired shape by scanning ion beam and metallize a desired area into a desired shape by Pt metallization. The properties allow a FIB system to repair semiconductor circuits and analyze the cross section of failures found in the minute area of semiconductor components.

FIB (Focused Ion Beam, 미세 단면/증착 전처리)

FIB Applications

  • Circuit repair
  • Chip construction analysis
  • Chip failure analysis
  • Intermetalliccompound construction analysis