Test Analysis & Equipment Utilization

Failure Analysis Service

Electronic Part Failure Analysis

SEM (Scanning Electron Microscope)

Scanning Electron Microscope (SEM) is used for magnifying, observing and analyzing the micro parts of a sample. Unlike an optical microscope with the magnification capability up to 1,500X, SEM magnifications can go to more than 800,000X. As it is easy to produce samples for observation, it is widely used to observe the surface of a sample. It can be also used to observe a sample at low magnifications of 10~100X. While the visibility is narrow at high magnifications, it is wider at low magnifications. Therefore, low magnifications are required to observe the whole area of an object. SEM is a type of electron microscope that produces images of a sample by scanning it with a focused beam of electrons. The electrons interact with atoms in the sample, producing secondary electrons that contain information about the sample's surface topography and composition. Then an energy dispersive X-ray spectroscope mounted to the SEM can analyze the composition of a sample.

SEM (Scanning Electron Microscope)

SEM Applications

  • Surface analysis
  • Failure analysis: Package, Die, PCB, SMT Level
  • Reverse Engineering
  • Length measurement
  • VC Image
  • Component analysis: Point, Line, Mapping

EDS(Energy dispersive X-ray spectroscope)

Energy dispersive X-ray spectroscope (EDS) is a system that analyzes the chemical composition of an unknown sample and detects and amplifies characteristic x-ray generated from the sample by a P-i-n detector at the energy form, and displays it as the form of spectrum.

EDS (에너지 분산 X선 분광분석기 : Energy dispersive X-ray spectroscope)

EDS Applications

  • Qualitative analysis of impurities or contaminated areas
  • Line component analysis
  • Mapping analysis

Photon Emission Microscope

Photon emission microscope is a system that detects weak photon generated from defective locations when electric signals are applied to wafer and packaged devices, and used for detecting leakage current or locations of short circuits. After reading the patterns of IR laser beam scanned from a device, it analyzes the image of CCD camera or InGaAs camera and finds the location of failures. his system is usually used for detecting failures including junction leakage, oxidation breakdown, ESD failure, hot carrier, and latch up.

Photon Emission Microscope (Photon 방출 분석 시스템)

Photon Emission Microscope Applications

  • Standby Current failure
  • Pin Leakage failure
  • ESD failure
  • Detection of latch-up points

Thermal Emission Microscope

Thermal emission microscope is a system that detects heat generated from defective locations when electric signals are applied to a device, and used for detecting leakage current or locations of short circuits. After reading the patterns of IR laser beam scanned from a device, it analyzes the image of an InGaAs camera and finds the location of failures. This system is usually used for detecting failures including oxide-layer microplasma leakage, oxide-layer breakdown, and short circuit of metallizations.

Thermal Emission Microscope

Thermal Emission Microscope Applications

  • Short of metal lines
  • Resistor failure on contacts
  • Oxide-layer microplasma leakage
  • Destruction of oxide layers
  • Observation of abnormal temperature on the device

Dye & Pry Analysis

Dye and pry analysis is used to detect a crack and its locations and size by infiltrating dye into the interconnected areas between electronic component and printed circuit board. It detects solder joint crack or open failures.
Dye & Pry Analysis

Dye & Pry Applications

  • Electronic Component-PCB Solder Joint Crack
  • Electronic Component-PCB Solder Joint Problem