Customers & Technology Support

Cases of failure analysis

  • Fault LocalizationGate
    Fault LocalizationGate
    Emission Microscope Analysis
  • Gate Filament (ESD)
    Gate Filament (ESD)
    SEM Analysis
  • Metal Burnt out (EOS)
    Metal Burnt out (EOS)
    High Power Scope Analysis
  • Punch Through (ESD)
    Punch Through (ESD)
    High Power Scope Analysis
  • Gold Wire Broken (Sub. Del.)
    Gold Wire Broken (Sub. Del.)
    X-Ray Analysis
  • Substrate Delamination
    Substrate Delamination
    High Power Scope Analysis
  • Gold Wire Sagging
    Gold Wire Sagging
    SEM Analysis
  • Gold Wire Sagging
    Gold Wire Sagging
    SEM Analysis
  • PCB View
    PCB View
    High Power Scope Analysis
  • PTH Open
    PTH Open
    High Power Scope Analysis
  • PTH Open
    PTH Open
    High Power Scope Analysis
  • PTH Open
    PTH Open
    High Power Scope Analysis
  • PTH Open
    PTH Open
    High Power Scope Analysis
  • Package External Inspection (Top view)
    Package External Inspection (Top view)
    Low Power Scope Analysis
  • Package External Inspection (Side view)
    Package External Inspection (Side view)
    Low Power Scope Analysis
  • Cross section analysis of solder joint
    Cross section analysis of solder joint
    High Power Scope Analysis
  • Cross section analysis of solder joint open
    Cross section analysis of solder joint open
    High Power Scope Analysis
  • Cross section analysis of solder void
    Cross section analysis of solder void
    High Power Scope Analysis
  • Cross section analysis of solder ball non-wetting
    Cross section analysis of solder ball non-wetting
    High Power Scope Analysis
  • Dye & Pry analysis of solder ball non-wetting
    Dye & Pry analysis of solder ball non-wetting
    Low Power Scope Analysis
  • Cross section analysis of capacitor
    Cross section analysis of capacitor
    Low Power Scope Analysis
  • Tantalum capacitor External Inspection
    Tantalum capacitor External Inspection
    Low Power Scope Analysis
  • Tantalum capacitor Internal Inspection
    Tantalum capacitor Internal Inspection
    X-Ray Analysis
  • Cross section analysis of Tantalum capacitor
    Cross section analysis of Tantalum capacitor
    Low Power Scope Analysis
  • Internal crack of Tantalum capacitor
    Internal crack of Tantalum capacitor
    High Power Scope Analysis
  • LED Decapsulation
    LED Decapsulation
    Low Power Scope Analysis
  • External Inspection
    External Inspection
    Low Power Scope Analysis
  • Diode Internal Inspection
    Diode Internal Inspection
    X-Ray Analysis
  • No Die failure
    No Die failure
    X-Ray Analysis
  • LED External Inspection
    LED External Inspection
    Low Power Scope Analysis
  • LED Chip Inspection
    LED Chip Inspection
    High Power Scope Analysis
  • LED Chip Inspection (Enlarged view)
    LED Chip Inspection (Enlarged view)
    High Power Scope Analysis
  • LED failure analysis (Gold wire open)
    LED failure analysis (Gold wire open)
    X-Ray Analysis
  • Cross section of Photo coupler
    Cross section of Photo coupler
    SEM Analysis
  • Delamination between chip and sub
    Delamination between chip and sub
    High Power Scope Analysis
  • Delamination between chip and sub
    Delamination between chip and sub
    SEM Analysis
  • Delamination between chip and sub (Enlarged view)
    Delamination between chip and sub (Enlarged view)
    SEM Analysis
The QRT Functional Layout Analysis Report helps you understand the fundamental structure and design of the product you request. Basic manufacturing processes and design information can be used in cost analysis benchmarking.

Delayering

Delayering-Metal 4 Layer / Metal 3 Layer / Metal 2 Layer / Metal 1 Layer / Poly Layer / Active Layer
Delayering Application
  • Aluminum layer etch
  • Copper layer etch
  • Silicon oxidation layer etch
  • Polysilicon layer etch
  • Each layer etching and analysis for compound semiconductors
  • Semiconductor failure analysis
  • Reverse engineering

Functional Layout Analysis

Functional Layout Analysis
Application of FLA
  • Package photo, size & package marking
  • X-ray photo
  • Package construction
  • Die photo, die size & die marking
  • Top metal sufficient to see architecture / metal materi
  • Bonding pad information : pad count, bond pad count, bond pad size, bond pad open size, wire size and bond pad space
  • Cross section view
  • Process summary
  • Block standard cell measurements
  • High resolution photo of individual blocks
  • Memory analysis
  • Block density and average standard cell densi
  • IP analysis
  • Probe Pad Deposition
    Probe Pad Deposition
  • Platinum Deposition
    Platinum Deposition
  • Deposition Profile
    Deposition Profile
  • Precision Cross Section
    Precision Cross Section
  • Enlarged View
    Enlarged View
  • Cutting & Platinum Deposition
    Cutting & Platinum Deposition