고객 및 기술지원

불량분석 사례

  • Fault LocalizationGate
    Fault LocalizationGate
    Emission Microscope Analysis
  • Gate Filament (ESD)
    Gate Filament (ESD)
    SEM Analysis
  • Metal Burnt out (EOS)
    Metal Burnt out (EOS)
    High Power Scope Analysis
  • Punch Through (ESD)
    Punch Through (ESD)
    High Power Scope Analysis
  • Gold Wire Broken (Sub. Del.)
    Gold Wire Broken (Sub. Del.)
    X-Ray Analysis
  • Substrate Delamination
    Substrate Delamination
    High Power Scope Analysis
  • Gold Wire Sagging
    Gold Wire Sagging
    SEM Analysis
  • Gold Wire Sagging
    Gold Wire Sagging
    SEM Analysis
  • PCB View
    PCB View
    High Power Scope Analysis
  • PTH Open
    PTH Open
    High Power Scope Analysis
  • PTH Open
    PTH Open
    High Power Scope Analysis
  • PTH Open
    PTH Open
    High Power Scope Analysis
  • PTH Open
    PTH Open
    High Power Scope Analysis
  • Package External Inspection (Top view)
    Package External Inspection (Top view)
    Low Power Scope Analysis
  • Package External Inspection (Side view)
    Package External Inspection (Side view)
    Low Power Scope Analysis
  • Cross section analysis of solder joint
    Cross section analysis of solder joint
    High Power Scope Analysis
  • Cross section analysis of solder joint open
    Cross section analysis of solder joint open
    High Power Scope Analysis
  • Cross section analysis of solder void
    Cross section analysis of solder void
    High Power Scope Analysis
  • Cross section analysis of solder ball non-wetting
    Cross section analysis of solder ball non-wetting
    High Power Scope Analysis
  • Dye & Pry analysis of solder ball non-wetting
    Dye & Pry analysis of solder ball non-wetting
    Low Power Scope Analysis
  • Cross section analysis of capacitor
    Cross section analysis of capacitor
    Low Power Scope Analysis
  • Tantalum capacitor External Inspection
    Tantalum capacitor External Inspection
    Low Power Scope Analysis
  • Tantalum capacitor Internal Inspection
    Tantalum capacitor Internal Inspection
    X-Ray Analysis
  • Cross section analysis of Tantalum capacitor
    Cross section analysis of Tantalum capacitor
    Low Power Scope Analysis
  • Internal crack of Tantalum capacitor
    Internal crack of Tantalum capacitor
    High Power Scope Analysis
  • LED Decapsulation
    LED Decapsulation
    Low Power Scope Analysis
  • External Inspection
    External Inspection
    Low Power Scope Analysis
  • Diode Internal Inspection
    Diode Internal Inspection
    X-Ray Analysis
  • No Die failure
    No Die failure
    X-Ray Analysis
  • LED External Inspection
    LED External Inspection
    Low Power Scope Analysis
  • LED Chip Inspection
    LED Chip Inspection
    High Power Scope Analysis
  • LED Chip Inspection (Enlarged view)
    LED Chip Inspection (Enlarged view)
    High Power Scope Analysis
  • LED failure analysis (Gold wire open)
    LED failure analysis (Gold wire open)
    X-Ray Analysis
  • Cross section of Photo coupler
    Cross section of Photo coupler
    SEM Analysis
  • Delamination between chip and sub
    Delamination between chip and sub
    High Power Scope Analysis
  • Delamination between chip and sub
    Delamination between chip and sub
    SEM Analysis
  • Delamination between chip and sub (Enlarged view)
    Delamination between chip and sub (Enlarged view)
    SEM Analysis
QRT Functional Layout Analysis Report 의뢰 제품의 기본적인 구조 설계를 이해 할 수 있도록 도움을 드립니다. 또한 기본적인 제조 공정과 의뢰 제품의 설계 정보로 비용 분석을 위한 벤치 마크 자료로 활용될 수 있습니다.

Delayering

Delayering-Metal 4 Layer / Metal 3 Layer / Metal 2 Layer / Metal 1 Layer / Poly Layer / Active Layer
Delayering 적용 분야
  • Aluminum layer etch
  • Copper layer etch
  • Silicon oxidation layer etch
  • Polysilicon layer etch
  • 화합물 반도체 각 layer etch 및 분석
  • 반도체 불량 분석
  • Reverse engineering

Functional Layout Analysis

Functional Layout Analysis
FLA 적용 분야
  • Package photo, size & package marking
  • X-ray photo
  • Package construction
  • Die photo, die size & die marking
  • Top metal sufficient to see architecture / metal materi
  • Bonding pad information : pad count, bond pad count, bond pad size, bond pad open size, wire size and bond pad space
  • Cross section view
  • Process summary
  • Block standard cell measurements
  • High resolution photo of individual blocks
  • Memory analysis
  • Block density and average standard cell densi
  • IP analysis
  • Probe Pad Deposition
    Probe Pad Deposition
  • Platinum Deposition
    Platinum Deposition
  • Deposition Profile
    Deposition Profile
  • Precision Cross Section
    Precision Cross Section
  • Enlarged View
    Enlarged View
  • Cutting & Platinum Deposition
    Cutting & Platinum Deposition